Material testing for hardness via Nanoindentation

5 December 2017 - 7 December 2017
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Nanoindentation is mechanical tester that can provide micromechanical properties of hardness and reduced modulus. Due to its capability of conducting test in localized and nanometer scale, nanoindentation test is a suitable tester to be used to evaluate the micromechanical properties of semiconductor that has ever decreasing trend of building structure. Localized and nanometer
scale of measurement using nanoindentation test has provided some advantageous compared to that of conventional mechanical tests like tensile, compress, bending, and hardness tests to name a few. This is because the micromechanical data obtained from nanoindentation test can explain the individual properties and interaction with the surrounding materials as compared to that of data obtained from conventional mechanical test which is more into bulk mechanical properties. Thus, nanoindentation test is the suitable testing enabler that can be used to analyze the micromechanical properties, performance, and also the process history (load bearing) of the materials which are very important to the improvement of the existing process, design and production of semiconductor industry.



Upon completion, participants should be able to demonstrate/understand each of the following:

  • The principle of using nanoindentation
  • Differences between nanoindentation and bulk mechanical testing
  • How to conduct the nanoindentation test
  • Interpretation of the data obtained from nanoindentation
  • Possible applications using nanoindentation test

Venue: MIMOS, Technology Park Malaysia

Time: 9am-5pm


To Register & for More Information:
Business Development (MSSB), MIMOS Berhad
Call : +603-8995 5000 ext. 55279 (Fara), 55642 (Amy)
Email :,


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5 December 2017
7 December 2017


MIMOS Berhad
Technology Park Malaysia
Kuala Lumpur, 57000 Malaysia
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