MIMOS Berhad
MOSTI1Malaysia
MIMOS Wafer Fab

Failure Analysis

MIMOS Wafer Fab is equipped with the state-of-the-art failure analysis equipment to support its fabrication facility to diagnose the cause of any failure. Our failure analysis facility can support both wafer level and package level failure analysis. Failure Analysis by us is an ideal service for the regional semiconductor industry as it offers shorter turn around time and fair prices.

Furthermore, our analysts have first-hand knowledge in wafer fabrication, and with the experiences that we had gathered all these years; we have in-depth knowledge in wafer fabrication process and problems. We always place great emphasis on obtaining accurate and reliable results and believe our success is derived from the quality of the client-analyst interaction. Our customers are always assured of complete confidentiality on all work performed and your intellectual property will be kept strictly confidential.

MIMOS Wafer Fab Failure Analysis Analytical Capabilities

  • Focused Ion Beam
  • FEG-Scanning Electron Microscope
  • Energy Dispersive Spectrometer
  • Reactive Ion Etching
  • Photon Emission Microscope
  • Confocal Microscope
  • Real Time X-Ray
  • Scanning Acoustics Microscope
  • Decapsulator
  • Curve Tracing
  • Polisher

What is failure analysis?

 
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