Microelectronics has been at the core of MIMOS’ R&D since the organisation’s inception. Today, the functions of MIMOS Microelectronics Cluster are divided into three inter-related areas; IC Design & Microelectronics, Wafer Fabrication Technology, and Micro-Electro Mechanical Systems (MEMS) & Microsystems.
IC Design & Microelectronics focuses on the R&D of ubiquitous low-power sensing element; small-scale systems integration; provides custom-made chip design and supporting electronic system and prototyping services, as well as other IC and electronic device design and development projects.
Wafer Fabrication Technology provides a wide range of services to the industries and universities including Failure Analysis (FA) Services and Wafer Testing and Semiconductor Training.
Microsystems & MEMS undertakes the development of innovative sensor platforms for various vertical applications such as Precision Agriculture, Aquaculture, Environmental Monitoring and Healthcare. It covers the areas of micro-sensor design, nano-material and structures integration, smart electronics interface, advanced electronic packaging and wireless connectivity to deliver platform solutions.
For R&D collaborations, please send an e-mail indicating the area of collaboration to: email@example.com
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