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Overview of services under STC, 70-100 words

Failure Analysis

The Lab is equipped with a complete spectrum of advanced analytical tools to provide high-value-added services for the E&E industry and academia.

The lab is a strategic cross-cutting enabler to complete E&E ecosystem support by providing much-needed services in Malaysia. Innovative and flexible engagement models are offered to suit the needs of the industry, academia, and local Failure Analysis consultants.

Electrical Verification
  • Logic and High Voltage Curve Tracer Electrical/parametric test verification tool for logic and high-voltage devices
Non-Destructive Inspection
  • Real-time X-Ray (X-Ray) 2D inspection tool 
  • 3D X-Ray 3D inspection tool 
  • Scanning Acoustic Microscope (SAM) Inspection 
Material Analysis
  • Auger Electron Spectroscopy (AES)
  • TOF Secondary Ion Mass Spectroscopy (ToF-SIMS)
  • X-Ray Photoelectron Spectroscopy (XPS)
  • TEM Upgrades with Electron Energy Loss Spectroscopy (EELS)
  • Fourier Transform Infrared Spectroscopy (FTIR)
  • Ultraviolet-visible and Infrared Spectroscopy (UV-Vis-IR)
  • Inductively Coupled Plasma Mass Spectrometry (ICP-MS)
  • Gas Chromatography-Mass Spectroscopy (GC-MS/MS)
  • Nanoidentation
Fault Localisation
  • Photon Emission Microscope (PEM) and Optical Beam Induced Resistance Change (OBIRCH) Fault localisation system 
  •  Thermal Emission Microscope Fault localisation system 
  • Magnetic Current Imaging (MCI) Fault localisation system 
Physical Analysis
  • Laser and Chemical Decapsulator Package opening 
  • Confocal and Digital Microscopes Visual inspection tool 
  • Dual-Beam (FIB and FESEM) High resolution inspection system
  • Field Emission Gun Scanning Electron Microscope (FESEM) 

Wafer And IC testing Lab

MIMOS Wafer & IC Testing Lab provides wafer sort and testing services for processing of up to 200mm wafers. The lab is equipped with Automatic Test Equipment (ATE) for evaluating and testing Digital, Analog/Mixed-Signal (AMS) and Power Devices, and provides engineering support for product prototyping.

Parametric Test (PCM)/Wafer Acceptance Test (WAT)
  • 4072 Auto Parametric Test System
  • 4073 Auto Parametric Test System
  • 4082A Auto Parametric Test System
Wafer Sort Capabilities/Chip Probe Test (CP)
  • Analog/Mixed-Signal Test Sytem
  • Functional Test System (Microcontroller and Consumer ICs)
Wafer-Level Reliability Testing and Monitoring
  • Plasma Damage and Hot Carrier Injection (HCI Degradation) Test System (Automatic)
  • Mobile Ionic Contamination (MIC), Electromigration, CV Measurement and Gate Oxide Integrity Test System (Manual)
Device and Interconnect Modelling
  • Device Modelling and Simulation for Device & IC Design (BSIM3v3)
  • Interconnect Parasitics Modelling


We produces 200mm wafers at medium volume capacity. Our operation is backed by robust technologies from IMS Germany and NTT Japan. The 200mm wafer fabrication plant is fully-equipped with industry-standard technology as well as machinery, to cater to various industrial and research requirements.

We are able to provide a wide range of services including Design Support, Customised Processes, Multi-Project Wafer (MPW) programmes and Product Development & Fabrication in CMOS, HVMOS, Digital, Analog and Microelectromechanical Systems (MEMS) technology platforms.

Equipment List
  • Furnaces for Annealing and Various Film Deposition/Growth
  • High Clean Bench
  • Low Clean Bench
  • Etch Bench
  • Aluminum Etch Bench
  • Metal Etch (Silicide Etch)
  • Wafer Scrubber System
  • Solvent Bench System
  • High Current Ion Implanter System
  • Medium Current Ion Implanter System
  • Physical Vapour Deposition (PVD) System
  • Rapid Thermal Processing (RTP) System
  • Spin-on Glass (SOG) Coater System
  • Film Stress Measurement System
  • Four Point Probe System
  • Fourier Transform Infrared Spectroscopy (FTIR)
  • Wafer Marker
  • Surfscan Inspection System
  • Plasma Enhanced Chemical Vapour Deposition (PECVD) for Silicon Dioxide and Silicon Nitride Deposition
Equipment List
  • Tungsten Silicide CVD System
  • Tungsten CVD and Etchback System
  • Sub-Atmospheric Chemical Vapour Deposition (SACVD) System
  • Chemical Mechanical Polishing (CMP) System
  • Bare Wafer Inspection System
  • Reactive Ion Etching (RIE) equipment for Films (Oxide, Nitride, Poly, AlCu, AlSiCu, Silicon) Etching
  • Poly Backside Etcher
  • Resist Asher
  • Step Height System
  • Film Thickness Measurement System
  • Ellipsometer System
  • Stepper System
  • Scanner System
  • Coater/Developer
  • Deep Ultra Violet (DUV) System
  • Oven System
  • Overlay System
  • Pattern Wafer Inspection System
  • Critical Dimension Scanning Electron Microscope (CDSEM) System  Inspection Microscope System

Hands-On Skills Development Programme

With over 20 years of experience in Wafer Fabrication, Failure Analysis, Wafer & IC Testing, and IC Design. MIMOS SEMICONDUCTOR offers on-the-job, high-end customised training schemes based on real industry needs.

To date, we have trained more than 1,200 engineers to become highly qualified experts in semiconductors. Courses are built on a 20:80 ratio of theory and hands-on experience.

The skills development programme focuses on:
  1. Wafer Fabrication Processes
  2. Failure Analysis
  3. Reliability Testing
  4. Semiconductor Testing
  5. Integrated Circuit Design
Programme Objectives
  • Equip undergraduates with relevant industry experience through structured development schemes
  • Enhance graduates’ and engineers’ skills through upskilling and advanced skills development courses
  • Experiential hands-on learning environment using MIMOS’ industry-grade facilities