MIMOS made a significant global impact at the Osaka Expo 2025, proudly showcasing its cutting-edge Flexible Electronics Conductive Ink during MOSTI Week from 12-16 May 2025.
This advanced, in-house developed technology, a versatile enabler for next-generation flexible electronic devices, such as printed sensors, smart packaging, and low-power circuits, captivated visitors from around the world. The overwhelming interest was evident, with the Malaysia Pavilion attracting more than 22,000 visitors on 14 May 2025 alone, part of the expo’s impressive 125,000 attendees on that day.
This global promotion follows a pivotal milestone on 15 April 2025, when MIMOS officially signed a Technology Licensing Term Sheet with Tanjung Plus Engineering Sdn Bhd for the conductive ink. This agreement paved the way for commercial adoption, signalling that MIMOS’ R&D&C&I (Research, Development, Commercialisation, and Innovation) ecosystem is successfully bridging the gap between laboratory breakthroughs and industrial deployment, reaffirming its commitment to driving Malaysian innovations onto the global stage.
