Thermal Management for High Power Devices Mount on Stack-up Printed Circuit Board (PCB)

150 150 MIMOS Berhad


Ahmad Redzman, Khairom Nizam Mohamed, Zharfan Hamdan , Tengku Azhar, Aizuddin



To minimise foot print area of PCB in a product which all electronics components is mounted on, the PCB can be arrange in stack up condition. The electronic components comprises of high powered electronics devices such as Power Amplifier, Linear Regulator, Central Processing Unit (CPU) and Single Pole Double Throw (SPDT) switch are used in high power application such as Radio Frequency (RF) communication to boost signal power. These electronics components generate massive heat during the amplification process due to high current. This study focuses on the best ways to remove heat from these high power electronics devices in stack up PCB to the ambient in order to maintain recommended junction temperature from manufacturer. The study also discuss about ease of assembly of the stack up PCB into its casing.



International Journal of Electronics Communication and Computer Engineering (IJECCE), 2019